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XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair TBK Worldwide 100-240 volt AC input

SKU 98384691748
USD25.89 USD61.89
4.8

Pay in 4 interest-free payments of $6.47 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 6 - Sep 11

Pit notes

Duotone bay — asphalt brief on the left, yellow-folded service sheet on the right.

Service sheet
Description

Worldwide 100-240 volt AC input voltage

Bubble Remover For iPhone/ Samsung/Huawei/ Xiaomi/ HTC/ Motolora/ Oppo/ LG/ SONY

· Free ROTS Operating system

DES 560B Precision Handheld Digital Hot Air Gun De-Soldering Station

Two ways of temperature display modes (centigrade ℃

XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair TBK Worldwide 100-240 volt AC inputXZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone A8 A16 Qualcomm MTK Hisilicon CPU tin planting. XZZ L23 BGA Reballing Stencil Platform for iPhone 6 to 14 Pro Max A8 A9 A10 A12 A13 A14 A15 A16, Qualcomm, MTK, Hisilicon CPU IC soldering repair. Features: Magnetic power positioning with strong magnetic force and automatic alignment. Built in powerful magnets with strong adsorption for easy pick up and fast maintenance. Easy to operate

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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